Cleaning Systems

UV-300

UV-Ozone Cleaning System
Samco's UV-300 uses a combination of ultraviolet radiation and ozone to remove organic materials from a variety of substrates, improve wettability and enhance adhesion. The UV-300 is clean, reliable and simple to operate. Unlike plasma cleaning systems, it does not damage delicate structures or require a complicated, high-maintenance vacuum system. Nor does it use wet chemistry's messy, corrosive or toxic solvents.

Dimensions:

Main Unit: 550(W) x 430(D) x 605(H) mm



Contact Us

  • Features
  • Applications
  • Large reaction chamber accommodates substrates of varying sizes up to 12" in diameter

  • Rotating sample stage ensures high uniformity of cleaning /stripping rate across the substrate surface

  • Built-in "ozone killer" for complete removal of ozone in the exhaust

  • Simple to operate

  • Temperature control (Ambient to 300°C)

  • Completely dry process and will not cause any electrical damage to circuits

  • Operates at atmospheric pressure

  • Door interlock system

  • Removing organic contamination

  • Pre-clean wafers prior to deposition/coating

  • Ink removal from wafers

  • Descumming of photoresist and polyimide

  • Surface modification for better adhesion

  • Improving lube coverage on magnetic disks

  • UV curing

  • Growth of thin stable oxide films on silicon and gallium arsenide (e.g. MOS gate oxide)

CONTACT US

TECH NOTES

Samco Customers News from Users of Samco Products

Upcoming Exhibitions

Back to Top