Cleaning Systems

UV-2

Bench top UV-Ozone Cleaning System
Samco's UV-2 is a compact, high-performance, bench top, UV-Ozone Cleaning system. The UV-2 is modular in design and can be configured specifically, upon order, for a number of cleaning, stripping or UV-curing applications. This system is drawer loaded and uses patented technology to uniformly distribute ozone and UV light over the surface of wafers or other substrates. The system employs a programmable logic controller and safety interlocks to protect the operator from hazardous exposure to process ozone and UV light.
This easy to operate system uses a unique combination of ultraviolet radiation, ozone and heat to gently, yet effectively, remove organic materials from a variety of substrates including silicon, gallium arsenide (GaAs), Sapphire, metals, ceramics, quartz and glass.
The versatile UV-2 is well-suited for a variety of applications such as substrate cleaning, photoresist descumming, improving wettability, and UV curing. By operating at atmospheric pressure, the Samco UV-2 eliminates the need for a cumbersome, high-maintenance vacuum system. This system is CE marked and UL certified.

Dimensions:

Main Unit: 610(W) x 572(D) x 426(H) mm


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  • Features
  • Applications
  • Accommodates a variety of wafer sizes up to 8 inches in diameter

  • Compact, uses minimum bench top space

  • Heated sample stage increases cleaning/stripping rates

  • Broad process temperature range (Ambient to 300°C)

  • Completely dry process and will not cause any electrical damage to circuits

  • Operates at atmospheric pressure - no vacuum system required

  • Drawer interlock system guarantees system is inoperable when drawer is open

  • Automatic nitrogen purging system purges the UV-2 chamber after every run

  • Built-in ozone catalyst ("ozone killer") unit

  • Sealed chamber during process prevents device contamination from atmospheric air

  • Removing organic contamination

  • Pre-clean wafers prior to deposition (e.g. GaAs prior to MBE, sapphire prior to HgCdTe)

  • Descumming photoresist and polyimide

  • Modifying surfaces for better adhesion

  • Final cleaning before wafer bonding

  • UV curing

  • Growth of thin stable oxide films (Ge, Si)

  • Cleaning of AFM tips

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