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LSCVD (Liquid Source CVD) Systems

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Samco's LSCVD (Liquid Source CVD) systems achieve superior step-coverage and gap-fill performance, required for the MEMS, 3D-LSI, and Opto Electronics markets. Importantly, the technology enables deposition at lower temperatures and doesn't require toxic or flammable gases. LSCVD systems can deposit high-quality TEOS-SiO2, LS-SiN, High-k think film, and Diamond-like-carbon (DLC).

PD-100ST

PD-100ST

  • Low temperature deposition
  • High deposition rates (>300nm/min)
  • Highly conformal films for MEMS and other High Aspect Applications
  • TSV and 3D packaging development

Details

PD-270STP

PD-270STP

  • Liquid source CVD system
  • Low-temperature thick oxide deposition
  • Process up to 8" wafers
  • High deposition rates

Details

PD-270STL

PD-270STL

  • Liquid source CVD system
  • Low-temperature thick oxide deposition
  • Process up to 8" wafers
  • Load lock version of the PD-270STP

Details

PD-270STLC

PD-270STLC

  • Liquid source CVD system
  • Low-temperature thick oxide deposition
  • Process up to 8" wafers
  • Cassette-to-cassette production system

Details

PD-330STC

PD-330STC

  • Process up to 12" wafers
  • High deposition rates
  • Deposit in high aspect holes with complete conformity
  • For TSV, 3D packaging and MEMS

Details

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