CVD Systems

Plasma Enhanced CVD (PECVD) Systems

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Utilized in compound semiconductor and silicon device fabrication, Plasma Enhanced Chemical Vapor Deposition (PECVD) systems are designed for the deposition of insulation and passivation films.
Samco PECVD systems can deposit high-quality silicon-based thin films (SiO2, Si3N4, SiOxNy, a-Si:H).

PD-220N

PD-220N

  • SiN and SiO2 film deposition
  • Process up to 8" wafers
  • Low cost, small footprint
  • Fume hood

Details

PD-220NL

PD-220NL

  • Oxide and Nitride deposition
  • Load-locked PECVD system
  • Process up to 8" wafers
  • Compact footprint
  • Recipe storage & data logging

Details

PD-220LC

PD-220LC

  • Production type system
  • Deposition of passivation layers and interlayer dielectrics
  • Cassette-to-cassette production system
  • Process up to 8" wafers

Details

PD-2203L

PD-2203L

  • Modular system (up to 3 chambers)
  • Compact foot print
  • Prevents cross-contamination

Details

PD-3800L

PD-3800L

  • Oxide and Nitride deposition
  • Loadlock version of PD-3800
  • High-volume manufacturing

Details

PD-5400

PD-5400

  • Deposition of Silicon Nitride
  • Deposition of Silicon Oxide
  • Process up to ⌀428 mm samples
  • Excellent thickness uniformity

Details

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