Etching Systems


ICP Etching System for Compound Semiconductors
The Samco RIE-330iPC is a cassette to cassette type Inductively Coupled Plasma (ICP) reactive ion etching system used to anisotropically etch all types of semiconducting, insulating, and metallic films. The system consists of the reaction chamber, the load lock chamber, and the cassette chamber. The system is equipped with a newly developed ICP source and delivers excellent uniformity performance over a wide area.

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  • Features
  • Applications
  • Proprietary SST Coil ICP electrode

    Proprietary SST Coil ICP electrode

  • Cassette-to-Cassette production type system

  • Up to 8 gas lines possible

  • Large 330mm sample stage

  • Capable of simultaneous processing of twenty seven 2" wafers or seven 4" wafers

  • Data management and recipe management

  • Multi-joint arm wafer handling robot

  • High-volume LED production

  • Etching of GaN (Gallium Nitride)

  • Sapphire etching



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