Etching Systems

RIE-100iPC

Fluorine ICP Etching System (Cassette-to-Cassette)
Samco's RIE-100iPC is a high value cassette-to-cassette ICP etching system specifically designed for fluorine gas type production applications where maximum return on investment is required. The system features an atmospheric cassette and Samco's proprietary tornado coil electrode that efficiently generates stable high-density plasma which ensures high selectivity, superior etching precision and excellent uniformity. The RIE-100iPC is ideal for applications that require etching of silicon oxide, silicon, photo-resist or metals.

Dimensions:

Main Unit: 1140mm (W) x 1690mm (D) x 1970mm (H) 

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  • Features
  • Applications
  • Low cost, high value, small footprint design concept

  • High-speed Direct transfer of max. Φ8" wafers

  • Cassette-to-Cassette production type system (atmospheric cassette)

  • Active wafer temperature control (Helium backside cooling)

  • Electrostatic chuck for wafer clamping

  • Fully automatic operation using graphical touch panel screen

  • Data management and recipe management

  • Stripping of passivation materials including silicon nitride, silicon dioxide and silicon oxynitride

  • Resist ashing

  • Anisotropic etching of all types of silicon-based films, compound semiconductors and refractory metals including Si, SiO2, Poly-Si, Si3N4, GaAs and Mo

  • Fabrication of SAW devices

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