Etching Systems

ICP Etching Systems

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ICP Etching system takes advantage of the latest inductively coupled plasma (ICP) technology. Samco's proprietary ICP plasma source, the "Tornado Coil Electrode", enables reliable and uniform etching required for next generation devices.

RIE-600iP

RIE-600iP

  • Process up to ø6" wafers
  • Load-lock type
  • Stable processing at high RF powers and low pressures
  • High capacity vacuum system
  • Height-adjustable lower electrode
  • High voltage ESC

Details

RIE-600iPC

RIE-600iPC

  • Process up to ø6" wafers
  • Cassette-to-cassette type
  • Stable processing at high RF powers and low pressures
  • High capacity vacuum system
  • Height-adjustable lower electrode
  • High voltage ESC

Details

RIE-400iP

RIE-400iP

  • Process up to ø4" wafers
  • Load-lock type
  • Plasma at low powers and pressure
  • Active temperature control

Details

RIE-330iPC

RIE-330iPC

  • Process up to three ø6" wafers
  • ø330mm sample stage
  • Cassette-to-cassette type
  • Cassette holds 5 wafer trays
  • ESC and Helium backside cooling

Details

RIE-100iPC

RIE-100iPC

  • Low cost, high value, small footprint design concept
  • High-speed Direct transfer of max. ø8" wafers
  • Fabrication of SAW devices
  • Active temperature control

Details

RIE-200iP

RIE-200iP

  • Up to ø6" wafers (ø8" optional)
  • load-lock type
  • ESC and He backside cooling
  • Small footprint and "all-in-one" design

Details

RIE-230iPC

RIE-230iPC

  • Processes up to ø8" wafers
  • Cassette-to-cassette type
  • Cassette holds 25x 6" wafers
  • ESC and Helium backside cooling

Details

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