Etching Systems


Reactive Ion Etching System
Samco's RIE-300NR is a high-performance, fully automatic, high precision Reactive Ion Etching system, designed for processing 300mm wafers. A computerized touch panel provides a user-friendly interface for parameter control and recipe storage.
Etching is performed with minimum sidewall deterioration and a high selectivity between materials. The RIE-300NR chamber is equipped with four-directional pumping mechanism that maximizes uniformity.


Main Unit: 850(W) x 1680(D) x 1913(H) mm

Pump Unit: 590(W) x 170(D) x 230(H) mm

Contact Us

  • Features
  • Applications
  • Process wafers up to 12" in diameter (Twelve 75mm wafers, eight 100mm wafers or three 150mm wafers)

  • Fully automatic "One-button" operation with full manual override

  • Highly selective anisotropic etching

  • Easy to use computerized touch panel for parameter control, recipe entry and storage

  • Anisotropic etching of all types of silicon-based films, compound semiconductors and refractory metals including Si, SiO2, Poly-Si, SiN, GaAs and Mo

  • Manufacturing of micromachines

  • Stripping passivation, SiN and Oxide layers perfectly for semiconductor failure analysis



Samco Customers News from Users of Samco Products

Upcoming Exhibitions

Back to Top