Etching Systems

RIE-200LC

Vacuum Cassette Type Reactive Ion Etching System
Samco's RIE-200LC is a high specification RIE system equipped with a transfer and vacuum cassette chamber. These vacuum chambers allow safe and repeatable etching using chlorine gases, while improving the systems throughput.
The RIE-200LC yields excellent etching patterns with minimum side etch for a wide variety of materials such as metals, compound semiconductors (GaAs, GaN, etc.), silicon and poly-silicon. The user friendly touch panel interface enables the operator to easily create, edit, store and manage etch recipes.

Dimensions:

Main Unit: 1206mm (W) x 2000mm (D) x 2010mm (H)

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  • Features
  • Applications
  • Process single wafers up to 8" inches or batches of multiple wafers

  • The process chamber is isolated from the environment by a load-lock chamber, which improves process reliability and accuracy

  • The wafers are stored in a vacuum cassette chamber which prevents after etch corrosion when using chlorine gases and improves throughput

  • Electrostatic chuck for wafer clamping and active substrate temperature control

  • High speed and uniform multi-port evacuation system

  • Superior anisotropic etching performance for silicon films (Si, Poly-Si, SiO2, Si3N4 etc)

  • Etching of various metal films

  • Etching of compound semiconductors such as GaAs, GaN, etc.

  • Production of waveguide devices

  • Fabrication of micromachines

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