Application

TSV

HOME > Applications > TSV

Manufacturing Process

CMP

(Chemical Mechanical Polishing)

TSV

Photolithography

TSV

Deep RIE

RIE-800iPBC

Via Hole Formation

Si deep etching by the Bosch Process to create via hole

TSV

LS-CVD

PD-270STLC

Insulation film depo-
sition on via hole

Remove PR, Deposit TEOS-SiO2

TSV

Dry Etching

RIE-200C

Exposure of Lower Electrode

Selective etching of TEOS-SiO2

TSV

Barrier Layer Formation

Prevent Cu from spreading by TiN barrier layer

TSV

Formation of Cu plug by plating

TSV

CMP

(Chemical Mechanical Polishing)

TSV

Dry Etching

RIE-200C

RIE-10NR

Exposure of Cu plug by RIE

TSV

LS-CVD

PC-270STLC

SiO2 Film Formation

TSV

Photolithography

TSV

Dry Etching

RIE-200C

RIE-10NR

SiO2 Etching

TSV

CONTACT US

TECH NOTES

Samco Customers News from Users of Samco Products

Upcoming Exhibitions

Back to Top